Publications
Boehme, L., & Landau, U. (2016). Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating. Journal of The Electrochemical Society [00134651], 163 (7), D314-D321.
Boehme, L., & Landau, U. (2016). Rapid screening of plating additives for bottom-up metallization of nano-scale features. Journal of Applied Electrochemistry, 46 (1), 39-46.
Joi, A., Akolkar, R. N., & Landau, U. (2013). Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization. Journal of Electrochemical Society, 160 (12), D3145-D3148.
Joi, A., Akolkar, R. N., & Landau, U. (2013). Pulse Plating of Copper Germanide. Applied Physics Letters, 102 (), 134107.
Adelung, R., Ernst, F., Zheng, N., & Landau, U. (2004). In-situ Nanoscale Observation and Control of Electron-Beam-Induced Cluster Formation. Journal of Vacuum Science and Technology B, 22 (), 1797-1802.