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  4. Rohan Akolkar

Rohan Akolkar

Milton and Tamar Maltz Professor of Energy Innovation
Department of Chemical and Biomolecular Engineering
Case School of Engineering

Develops new electrochemical processes for applications including nano-material fabrication, energy storage, electrometallurgy and sensors.

Teaching Information

Teaching Interests

Chemical Engineering Undergraduate and Graduate Courses, e.g., Introduction to Chemical Systems, Transport Phenomena, Electrochemical Engineering; Corrosion Fundamentals; Mathematics for Chemical Engineers.

Research Information

Research Interests

Electrodeposition for Energy; Electrometallurgy; Electrochemical phenomena in next-generation batteries, semiconductor devices, and sensors.

External Appointments

  • PRESENT, Chief Scientist (Joint Appointment), Pacific Northwest National Laboratory

Publications

  • Zhang, Y., Klein, J., Akolkar, R. N., Gurkan, B. N., & Maginn, E. N. (2022). Solvation Structure, Dynamics and Charge Transfer Kinetics of Cu2+ and Cu+ in Choline Chloride Ethylene Glycol Electrolytes. The Journal of Physical Chemistry C, 126 (34), 6493 - 6499.
  • Shaheen, N., Dean, W., Penley, D., Kersten, B., Rintamaki, J., Vukmirovic, M., Gurkan, B., & Akolkar, R. N. (2022). Electro–oxidation of nitroxide radicals: Adsorption–mediated charge transfer probed using SERS and potentiometry. Journal of Electrochemical Society, 169 (5).
  • Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Mechanism of Electrochemical Oxidation of Nitroxide Radicals in Ethaline Deep Eutectic Solvent. Journal of The Electrochemical Society, 167 (14).
  • Vukmirovic, M., Adzic, R., & Akolkar, R. N. (2020). Copper Electrodeposition from Deep Eutectic Solvents—Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon. Journal of Physical Chemistry B, 124 (26), 5465-5475.
  • Shaheen, N., Mahesh, I., Vukmirovic, M., & Akolkar, R. N. (2020). Hysteresis effects and roughness suppression efficacy of polyethylenimine additive in Cu electrodeposition in ethaline. Electrochemistry Communications, 115
  • Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Electrolyte Additives for Controlling Roughness of Copper Electrodeposits Formed in Deep Eutectic Solvents. ECS Meeting Abstracts, MA2020-01 (19), 1206-1206.
  • Maraschky, A., & Akolkar, R. N. (2020). Temperature Dependence of Dendritic Lithium Electrodeposition: A Mechanistic Study of the Role of Transport Limitations within the SEI. J. Electrochem. Soc., 167, 062503 (2020). .
  • Gong, Y., & Akolkar, R. N. (2020). Electrochemical Atomic Layer Etching of Ruthenium. J. Electrochem. Soc., 167, 062510 (2020). .
  • Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Mechanism of Electrochemical Oxidation of Nitroxide Radicals in Ethaline Deep Eutectic Solvent. J. Electrochem. Soc., 167, 143505 (2020).
  • Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Hysteretic Effects and Roughness Suppression Efficacy of Polyethylenimine Additive in Cu Electrodeposition in Ethaline. Electrochemistry Communications, 115, 106721 (2020). .
  • Vukmirovic, M., Adzic, R., & Akolkar, R. N. (2020). Copper Electrodeposition from Deep Eutectic Solvents – Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs. Glassy Carbon. J. Phys. Chem. B, 124, 5465-5475 (2020).
  • Shen, X., Sinclair, N., Wainright, J. S., Akolkar, R. N., & Savinell, R. F. (2020). Evaluating and developing a reliable reference electrode for choline chloride based deep eutectic solvents. Journal of the Electrochemical Society, 167 , 086509.
  • Shen, X., Sinclair, N., Wainright, J., Akolkar, R. N., & Savinell, R. N. (2020). Evaluating and developing reliable reference electrode for choline chloride based deep eutectic solvents. J. Electrochem. Soc., 167, 086509 (2020). .
  • Liu, T., Liu, X., Bhattacharya, S., Ye, Z., He, R., Gao, X., Akolkar, R. N., & Sankaran, R. N. (2019). Plasma-Induced Fabrication and Straining of MoS 2 Films for the Hydrogen Evolution Reaction. ACS Applied Energy Materials.
  • Liu, T., Liu, X., Bhattacharya, S., Ye, Z., He, R., Gao, X., Akolkar, R. N., & Sankaran, R. N. (2019). Plasma-Induced Fabrication and Straining of MoS 2 Films for the Hydrogen Evolution Reaction. ACS Applied Energy Materials.
  • Zhan, X., Daniil, M., Liu, X., Willard, M. A., Akolkar, R. N., & Ernst, F. N. (2019). Amorphous Ni–P: Effect of Tungsten Alloying on Magnetic Properties. Journal of Alloys and Compounds.
  • Zhan, X., Daniil, M., Liu, X., Willard, M. A., Akolkar, R. N., & Ernst, F. N. (2019). Effect of tungsten alloying on magnetic properties of amorphous Ni--P. Journal of Alloys and Compounds, 786 , 742-749.
  • Liu, X., Bolton, O., & Akolkar, R. N. (2019). Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of a Novel Electrolyte Additive in Zinc Electrodeposition. J. Electrochem. Soc., 166 (13) , D583-.
  • Joi, A., Venkatraman, K., Tso, K., Dictus, D., Dordi, Y., Wu, P., Pao, C., & Akolkar, R. N. (2019). Editors' Choice�Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes. ECS Journal of Solid State Science and Technology, 8 (9), P516-P521.
  • Joi, A., Venkatraman, K., Watson, S., Dries, D., Dordi, Y., Wu, P., Paolini, R., & Akolkar, R. N. (2019). Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes. ECS J. Solid State Sci. Technol., 8 (9) , P516-.
  • Venkatraman, K., Gusley, R., Lesak, A., & Akolkar, R. N. (2019). Electrochemistry-Enabled Atomic Layer Deposition of Copper: Investigation of the Deposit Growth Rate and Roughness. J. Vac Sci. Technol. A, 37 , 020901.
  • Liu, X., Bolton, O., & Akolkar, R. N. (2019). Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition. Journal of The Electrochemical Society, 166 (13), D583-D588.
  • Shen, D., Vukmirovic, M., & Akolkar, R. N. (2019). Understanding the Role of Complexation in the Charge-Transfer Kinetics of the Cu2+ + e ↔ Cu1+ Redox Reaction in Ethaline Deep Eutectic Solvent. J. Electrochem. Soc., 166 (15) , E526-E532.
  • Shen, D., Steinberg, K., & Akolkar, R. N. (2018). Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu2+ → Cu1+ Reduction Reaction in Deep Eutectic Solvents. J. Electrochem. Soc., 165 (14), E808-E815.
  • Venkatraman, K., Joi, A., Dordi, Y., & Akolkar, R. N. (2018). Electroless atomic layer deposition of copper. Electrochemistry Communications, 91 , 45-48.
  • Liu, X., Venkatraman, K., & Akolkar, R. N. (2018). Communication�Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition. Journal of The Electrochemical Society, 165 (2), B9-B11.
  • Maraschky, A., & Akolkar, R. N. (2018). Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li + Transport within the Solid Electrolyte Interphase. Journal of The Electrochemical Society, 165 (14), D696-D703.
  • Gong, Y., Venkatraman, K., & Akolkar, R. N. (2018). Communication�Electrochemical Atomic Layer Etching of Copper. Journal of The Electrochemical Society, 165 (7), D282-D284.
  • Zhan, X., Zhang, P., Voyles, P., Liu, X., Akolkar, R. N., & Ernst, F. N. (2017). Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni–P. Acta Materialia, 122 , 400-411.
  • Liu, X., Richtering, W., & Akolkar, R. N. (2017). Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel–Phosphorus. Journal of The Electrochemical Society, 164 (7), D498-D504.
  • Venkatraman, K., Dordi, Y., & Akolkar, R. N. (2017). Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surface-Limited Redox Replacement of Underpotentially Deposited Zinc. Journal of The Electrochemical Society [00134651], 164 (2), D104-D109.
  • Yu, L., & Akolkar, R. N. (2017). Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation. Journal of Electroanalytical Chemistry, 792 , 61-65.
  • Shen, D., & Akolkar, R. N. (2017). Electrodeposition of Neodymium from NdCl 3 -Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling. Journal of The Electrochemical Society, 164 (8), H5292-H5298.
  • Kumar Rao, K., Ferguson, M., Murphy, K., Zhao, J., Lacks, D. J., & Akolkar, R. N. (2016). Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces. J. Appl. Electrochem, 46 , 1237.
  • Venkatraman, K., Gusley, R., Yu, L., Dordi, Y., & Akolkar, R. N. (2016). Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc. Journal of The Electrochemical Society [00134651], 163 (12), D3008-D3013.
  • Zhao, M., Yu, L., Akolkar, R. N., & Anderson, A. N. (2016). Mechanism of Electroless Copper Deposition from [Cu II EDTA] 2– Complexes Using Aldehyde-Based Reductants. Journal of Physical Chemistry C [19327447], 120 (43), 24789-24793.
  • Rao, K., Ferguson, M., Murphy, K., Zhao, J., Lacks, D. J., & Akolkar, R. N. (2016). Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces. Journal of Applied Electrochemistry, 46 (12), 1237-1243.
  • Banik, S., Rao, K., & Akolkar, R. N. (2016). Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode. Journal of The Electrochemical Society [00134651], 163 (9), E241-E247.
  • Miller, A., Yu, L., Blickensderfer, J., & Akolkar, R. N. (2015). Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Journal of Electrochemical Society, 162 (14), D630-D634.
  • Banik, S., & Akolkar, R. N. (2015). Suppressing Dendritic Growth during Alkaline Zinc Electrodeposition using Polyethylenimine Additive. Electrochimica Acta/Elsevier, 179 , 475-481.
  • Yu, L., Vashaei, Z., Ernst, F., & Akolkar, R. N. (2015). Electroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness EvolutionElectroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness Evolution. Journal of the Electrochemical Society, 163 , D374-D378.
  • Kung, C., Lin, P., Xue, Y., Akolkar, R. N., Dai, L. N., Yu, X. N., & Liu, C. N. (2014). Three dimensional graphene foam supported platinum–ruthenium bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications. Journal of Power Sources, 256 , 329–335.
  • Akolkar, R. N. (2014). Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature. Journal of Power Sources, 246 , 84-89.
  • Akolkar, R. N., & Sankaran, R. N. (2013). Charge transfer processes at the interface between plasmas and liquids. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 31 (5).
  • Joi, A., Akolkar, R. N., & Landau, U. N. (2013). Pulse Plating of Copper Germanide. Applied Physics Letters, 102 , 134107.
  • Yu, L., Guo, L., Preisser, R., & Akolkar, R. N. (2013). Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent. Journal of Electrochemical Society, 160 (12), D3004-D3008.
  • Banik, S., & Akolkar, R. N. (2013). Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive. Journal of Electrochemical Society, 160 (11), D519-D523.
  • Joi, A., Akolkar, R. N., & Landau, U. N. (2013). Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization. Journal of Electrochemical Society, 160 (12), D3145-D3148.

Additional Information

Patents Pending

  • 2023, "Dimensionally Stable Anode for Electrolytic Chlorine Evolution in Molten Salts" 63/383,098, Rohan Akolkar.
  • 2022, "System and Process for Sustainable Electrowinning of Metal" 18/054,277, Rohan Akolkar.