Performances of many systems operating in turbulent single-phase flows and in two-phase boiling flows are limited by the pumping power due to very high pressure drops in flow channels. A way to achieve high heat transfer while limiting the pressure drop is the use of fluid manifold architectures. Over the past few decades, researchers have designed various manifold architecture configurations, which include the inventive tree-like or fractal-based networks and the forced-fed architecture microchannels.
In our laboratory, we are investigating many such techniques for designing innovative solutions in large systems like air-cooled condensers as well as small systems line embedded channels in microelectronics. A recent study investigated 3-dimensional manifold channels in silicon substrate. The solutions can provide significant benefits in terms of thermal packaging in comparison to the traditional heat sink designs with significant reduction in mass and volume while also meeting the thermal performance requirements expected of future systems. Current work includes designing these channels with additive manufacturing in silicon nitride.
Related Publications
[13] Y. Qiu, C. Kharangate, J. Carter, J. McGuffin-Cawley, Si 3 N 4 Manifold Microchannels Cooling System for High Heat Flux Electronic Applications, in: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, 2022: pp. 1–7. http://10.1109/iTherm54085.2022.9899560
[12] M.N. Hasan, R. An, A. Akkus, D. Akkaynak, A.R. Minerick, C.R. Kharangate, U.A. Gurkan, Dynamic pH and Thermal Analysis of Paper-Based Microchip Electrophoresis. Micromachines. 12 (2021) 1433.https://doi.org/10.3390/mi12111433
[11] D. Jung, H. Lee, D. Kong, E. Cho, K. Wook, C.R. Kharangate, M. Iyengar, C. Malone, M. Asheghi, K.E. Goodson, H. Lee, International Journal of Heat and Mass Transfer Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits, Int. J. Heat Mass Transf. 175 (2021) 121192. https://doi.org/10.1016/j.ijheatmasstransfer.2021.121192.
[10] J Ki Wook, E Cho, H Lee, C Kharangate, F Zhou, M Asheghi, E Dede, K Goodson, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa, Journal of Electronic Packaging. https://doi.org/10.1115/1.4047846
[9] CR Kharangate, W Libeer, J Palko, H Lee, J Shi, M Asheghi, KE Goodson, Investigation of 3D manifold architecture heat sinks in air-cooled condensers, Applied Thermal Engineering 167, 114700. https://doi.org/10.1016/j.applthermaleng.2019.114700
[8] D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, CR Kharangate, M Asheghi, KE Goodson, H Lee, Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa, International Journal of Heat and Mass Transfer 141, 145-155. https://doi.org/10.1016/j.ijheatmasstransfer.2019.05.073
[7] KW Jung, H Lee, CR Kharangate, F Zhou, M Asheghi, EM Dede, KE Goodson, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa. ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. https://doi.org/10.1115/IPACK2019-6400
[6] KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, KE Goodson, Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance, International Journal of Heat and Mass Transfer 130, 1108-1119. https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.108
[5] R Alizadeh, M Schupbach, T Adamson, JC Balda, Y Zhao, S Long, KW Jung, CR Kharangate, M Asheghi, KE Goodson, Busbar design for distributed DC-link capacitor banks for traction applications, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4810-4815. 10.1109/ECCE.2018.8558380
[4] CR Kharangate, K Wook Jung, S Jung, D Kong, J Schaadt, M Iyengar, C Malone, H Lee, M Asheghi, KE Goodson, Experimental investigation of embedded micropin-fins for single-phase heat transfer and pressure drop, Journal of Electronic Packaging 140 (2). https://doi.org/10.1115/1.4039475
[3] N Pallo, C Kharangate, T Modeer, J Schaadt, M Asheghi, K Goodson, ..., Modular heat sink for chip-scale GaN transistors in multilevel converters, 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2798-2805. DOI: 10.1109/APEC.2018.8341414
[2] KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ..., Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITHERM.2017.7992457
[1] CR Kharangate, H Lee, T Liu, KW Jung, MK Iyengar, C Malone, ..., Thermal modeling of single-phase and two-phase 2D-chip cooling using microchannels, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITHERM.2017.7992485