Materials Microfabrication and Additive Manufacturing

Silicon wafers microfabricated as pin fins and manifold channels with cold plate substrate, channel sidewall (3d manifold)

The electrification across applications in automotive, defense and aerospace industries is pushing the limits of existing thermal management systems, and future designs will require new engineering solutions for meeting even larger heat loads. Additionally, there is a constant need to advance designs for light-weighting, highly-efficiency, and space-saving technologies. The increases in thermal loads pose significant challenges to designs of thermal management systems.

Novel combinations of materials microfabrication techniques and additive manufacturing techniques are being investigated in our laboratory. This includes microfabrication work on materials like silicon and silicon carbide and additive manufacturing techniques on silicon nitride to design innovative solutions in thermal management. With these solutions, we are trying to to reduce the mass and volume of existing systems while meeting the high heat dissipations needs of future systems. 

Related Publications

[10] J Ki Wook, E Cho, H Lee, C Kharangate, F Zhou, M Asheghi, E Dede, K Goodson, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa, Journal of Electronic Packaging. https://doi.org/10.1115/1.4047846

[9] CR Kharangate, W Libeer, J Palko, H Lee, J Shi, M Asheghi, KE Goodson, Investigation of 3D manifold architecture heat sinks in air-cooled condensers, Applied Thermal Engineering 167, 114700. https://doi.org/10.1016/j.applthermaleng.2019.114700

[8] D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, CR Kharangate, M Asheghi, KE Goodson, H Lee, Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa, International Journal of Heat and Mass Transfer 141, 145-155. https://doi.org/10.1016/j.ijheatmasstransfer.2019.05.073

[7] KW Jung, H  Lee, CR Kharangate, F Zhou, M Asheghi, EM Dede, KE Goodson, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa. ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. https://doi.org/10.1115/IPACK2019-6400

[6] KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, KE Goodson, Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance, International Journal of Heat and Mass Transfer 130, 1108-1119. https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.108

[5] R Alizadeh, M Schupbach, T Adamson, JC Balda, Y Zhao, S Long, KW Jung, CR Kharangate, M Asheghi, KE Goodson, Busbar design for distributed DC-link capacitor banks for traction applications, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4810-4815. 10.1109/ECCE.2018.8558380

[4] CR Kharangate, K Wook Jung, S Jung, D Kong, J Schaadt, M Iyengar, C Malone, H Lee, M Asheghi, KE Goodson, Experimental investigation of embedded micropin-fins for single-phase heat transfer and pressure drop, Journal of Electronic Packaging 140 (2). https://doi.org/10.1115/1.4039475

[3] N Pallo, C Kharangate, T Modeer, J Schaadt, M Asheghi, K Goodson, ..., Modular heat sink for chip-scale GaN transistors in multilevel converters, 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2798-2805. DOI: 10.1109/APEC.2018.8341414

[2] KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ..., Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITHERM.2017.7992457

[1] CR Kharangate, H Lee, T Liu, KW Jung, MK Iyengar, C Malone, ..., Thermal modeling of single-phase and two-phase 2D-chip cooling using microchannels, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITHERM.2017.7992485