AI-Enhanced Multimodal Sensing of Materials and Processes for Complete Product Lifecycle Performance
Roadmap Overview
Strategy
With recent advances in artificial intelligence (AI) and machine learning (ML) over the past few years, alongside improvements in distributed sensing, Internet of Things (IoT), and Edge Computing, there is a tremendous opportunity to combine AI/ML with physical domain knowledge (materials, processes, etc.) for manufacturing. This integration would make it possible to leverage the multi-scale, multimodal data streams from across a product’s service life to achieve significant improvements at each stage in its lifecycle, from materials synthesis and selection, to product design, manufacturing, deployment, and eventual retirement and/or recycling.
This roadmap sets out a vision for this desired future state, identifies major challenges and opportunities related to achieving the vision, and provides a set of implementation plans for overcoming the challenges and realizing the benefits of AI-enhanced multimodal sensing of materials and processes for complete product lifecycle performance.
Goals and Objectives
This roadmap establishes a plan to develop multimodal sensing and AI/ML-driven closed-loop control capabilities and data insights to help manufacturers improve full product lifecycle performance. There are four key objectives to enable this goal:
- Integrate Multimodal Data Over Multiple Timescales (throughout the product lifecycle)
- Capture Domain Insights from Materials Science and Manufacturing to guide Core Technology Developments
- Develop Feedback Strategies over Multiple Timescales that impact Materials Synthesis and Selection, Product and Process Design, Process Control, Product Service Life, and Retirement
- Develop Core Technologies necessary to achieve the vision (AI/ML, Multimodal Sensing and Imaging, Process Control and Automation, Physics-based Computational Models)
Core Focus Areas
The core focus areas for this roadmap are:
- Sensing, Data Acquisition & Data Management Across the Product Lifecycle
- Applications of AI/ML & Data Analytics Across the Product Lifecycle
- Comprehensive Integration of Data and AI/ML Insights Across the Product Lifecycle
Roadmap Release - February 27, 2024
We will also hold initial planning discussions for a proposed consortium, as the activities proposed in this roadmap are beyond the scope, funding, and capabilities of any single organization. Achieving the roadmap’s vision will require the coordinated efforts of a multistakeholder consortium, and we invite those interested in shaping and driving that consortium to attend and contribute.
The release event will include an overview of the roadmap, including the critical challenges and opportunities, as well as specific recommendations for research and development activities to begin building the needed Tools & Equipment, Standards & Techniques, and Training & Educational Resources.
To REGISTER and learn more about this in-person event, click here.
Please contact Nick Barendt nickbarendt@case.edu for additional information.
Download Roadmap
Roadmap Committee
This effort was lead and organized by:
Nexight Group supported the overall roadmapping process and helped to prepare the roadmap document.
Mike Yost led consortium-related activities.
Roadmap Contributors
Paul Ardis |
General Electric |
Mehmet Aydeniz |
University of Tennessee, Knoxville |
Nick Barendt* |
Case Western Reserve University |
Bernard Bewlay |
General Electric |
David Bourne |
Carnegie Mellon University |
Jackie Bowen* |
Nexight Group |
Brad Boyce |
Sandia National Laboratories |
Ross Brindle* |
Nexight Group |
Jian Cao |
Northwestern University |
Jennifer Carter |
Case Western Reserve University |
Vipin Chaudhary |
Case Western Reserve University |
Hikmat Chedid |
Lorain County Community College |
Clayton Cooper |
Case Western Reserve University |
Brian DeCost |
National Institute of Standards and Technology (NIST) |
Scott Drinkall* |
Nexight Group |
Robert Foy* |
Nexight Group |
Wentao Fu |
Boeing Additive Manufacturing (BAM) Intelligence Center |
Robert Gao* |
Case Western Reserve University |
Joseph Giampapa |
ARM Institute |
Charles Gifford |
21st Century Manufacturing Solutions |
Michael Grieves |
Digital Twin Institute |
Mike Groeber |
Ohio State University |
Markus Heinimann |
Arconic/Howmet |
David Icove |
University of Tennessee, Knoxville |
Mahdi Jamshid |
ASTM International |
Reeja Jayan |
Carnegie Mellon University |
Xiaodong Jia |
University of Cincinnati |
Jared Kosters* |
Nexight Group |
Dominik Kozjek |
Northwestern University |
John Lewandowski* |
Case Western Reserve University |
Ken Loparo* |
Case Western Reserve University |
Norbert Majerus |
Norbert Majerus Consulting LLC |
Jim Maloney |
Timken |
Michael McClellan |
Collaboration Synergies, Inc. |
Jack McNulty |
GOJO |
Nikunj Mehta |
Falkonry AI |
KC Morris |
National Institute of Standards and Technology (NIST) |
Steve Niezgoda |
Ohio State University |
Vincent Paquit |
Oak Ridge National Laboratory |
Joseph Powell |
Akron Steel Treating (AST) |
Clare Rimnac |
Case Western Reserve University |
Tony Rollett |
Carnegie Mellon University |
Andrew Saku* |
Nexight Group |
Michael Skocik |
ARM Institute |
Peng Wang |
University of Kentucky |
Jim Warren |
National Institute of Standards and Technology (NIST) |
Jonathan Wise |
Clean Energy Smart Manufacturing Innovation Institute (CESMII) |
Sarah Wolff |
Ohio State University |
Mike Yost* |
Bennit |
Jianjang Zhang |
Case Western Reserve University |
* = internal roadmap development team
Funding Acknowledgement
This work was performed under financial assistance award #70NANB22H049 from U.S. Department of Commerce, National Institute of Standards and Technology.